Products

Copper Electrofill Products

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Copper interconnects are replacing traditional aluminum interconnects due to copper's superior conductivity and reliability. Semiconductors that are made with copper wiring are up to four times faster, yet much simpler and cheaper to produce. An early proponent of copper, Novellus is helping to lead this revolution with the SABRE® Electrofill™ system.

SABRE Excel™

SABRE® Excel is the latest model of the industry-leading SABRE platform for copper damascene interconnect manufacturing. Designed for the 22 nm technology node and beyond, the SABRE Excel provides Novellus’ customers with superior fill and defect density performance. The system features a new deposition module that incorporates the company’s patented IRISCell™ technology, designed to control current modulation during the initial stages of the plating process for consistent feature fill. Additionally, Multiwave™ wafer bath entry has been incorporated into SABRE Excel to improve plating results on the thin PVD seeds which become more predominant at these advanced technology nodes.

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SABRE Excel

SABRE 3D

SABRE 3D is specifically designed for advanced wafer level packaging applications, including through-silicon vias, redistribution layers, pillars, under-bump metallization and bumping. SABRE 3D’s innovative modular design maximizes footprint density, enables integrated multi-layer processing, and supports field extendibility, making capacity additions easy and cost-effective. SABRE 3D incorporates several patented technologies to address the challenges of advanced wafer-level packaging, including APT™ technology to ensure robust wetting and reduce process time, XMM™ technology to control overburden, GDC™ technology to minimize thermally-induced via protrusion, and TurboCell™ technology to provide exceptional plating rates while maintaining superior uniformity.

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SABRE 3D