Technical Papers, Articles and Presentations

Electrochemical Requirements for Damascene Cu Electroplating
Presented at: Gordon Conference Meeting
July-Aug 2006

Low Pressure Deposition in a High Density Plasma CVD Reactor
Presented at: 25th International Symposium on Rarefield Gas Dynamics
July 2006

Measurements of Thermal Accomodation Coefficients
Presented at: 25th International Symposium on Rarefield Gas Dynamics
July 2006

Optimal Virtual Prototyping for Semiconductor Manufacturing Equipment
Presented at: MSC Software VPD Conference
July 2006

New Materials on the Roadmap
Presented at: Dupont Panel Session at SEMICON
July 2006

High Stress Silicon Nitride Films for Strained Silicon Technology
Presented at: Thin Films Users Group
June 2006

The Interconnect Challenge
Presented at: 16th Biennial University Government Industry Microelectronics Symposium
June 2006

Highly Reliable Interface of Self-aligned CuSiN process
Presented at: IITC
June 2006

Identifying and Eliminating Unique Copper Electroplating Defects
Published in: MICRO magazine
June 2006

Impact of Leveler Molecular Weight and Concentration on Damascene Copper Electroplating
Published in: 209th ECS Meeting
May 2006

Containing the Finite Size Effect in Copper Lines Semiconductor International
Published in: Semiconductor International
May 2006

In-Situ Formation of a Copper Silicide Cap for TDDB and Electromigration Improvement
Presented at: IRPS
March 2006

Optimizing Remote Plasma Cleans
Published in: Semiconductor International
March 2006

Metallization for the 45 nm Node
Presented at: NCAVS Annual Meeting
February 2006

Pulsed Nucleation Layer of Tungsten Nitride Barrier Film and its Application in DRAM and Logic Manufacturing
Presented at: Semicon Korea
Feb 2006

45 nm node integration of low-k and ULK
Published in: Solid State Technology
November 2005

Computer Simulation Accelerates Equipment and Process Design
Published in: Semiconductor International
November 2005

Advanced Back End Integration Issues
Presented at: NCAVS Annual Meeting
October 2005

Filling contacts using a pulsed nucleation layer of tungsten nitride
Published in: MICRO Magazine
October 2005

Performance & Productivity Improvement of Cu/Low k Interconnects
Presented at: Nikkei Microelectronics Seminar
September 16th, 2005

Measurements of Ti-Containing Barrier Materials and Low-K dielectric Films Using Backside Polishing SIMS
Presented at: SIMS XV 15th Annual Secondary Ion Mass Spectrometry Conference
September 15th 2005

Possible Paths for Cu CMP
Presented at: JST-CMP Users Conference
September 9th 2005

iALD Technology for Cu B/S Metallic Films
Presented at: ALD
August 8, 2005

UVTP-Cured ULK Coral for 65 nm and Beyond
Presented at: 2005 EAG Technical Seminar
July 13, 2005

Impact of Line Edge Roughness on Resistivity of Narrow Copper Interconnect Lines
Presented at: Copper Resistivity Workshop
June 9, 2005

Scattering Mechanisms in Narrow Copper Lines
Presented at: Copper Resistivity Workshop (Sematech & NVLS)
June 9, 2005

Impact of bath composition on the anneal characteristics of thinning copper films
Presented at: Resistivity Workshop (Sematech & NVLS)
June 9, 2005

Modeling of a Cleaning Process in a PECVD tool
Presented at: Fluent Summit, June 2005
June 8, 2005

45nm Reliability Issues
Presented at: International Interconnect Conference (IITC)
June 5, 2005

A Tertiary Current Distribution Model with Complex Additive Chemistry and Turbulent Flow
Presented at: ECS Conference
May 19, 2005

Surface Treatment Solutions for Low-k Dielectrics
Presented at: 2005 Surface Preparation & Cleaning Conference
April 19-20, 2005

Chemical Engineering Tools for Semiconductor Fabrication
Presented at: European Semiconductor
April 12, 2005

Practical Implementation of Interface A on a Novellus Gamma 2130 photoresist strip tool
Published in: Electronic Journal
April 11, 2005

Finding the Best Solution
Presented at: European Semiconductor
April 2005 issue

Advances in Cu Electrofill for Damascene Interconnects
Published in: Electronic Journal
April 2005 issue

Stress Migration and the Mechanical Properties Copper
Published in: IEEE International Reliability Physics Symposium
April 2005

UV-Assisted Processing for Advanced Dielectric Films
Published in: Solid State Technology
March 2005