Thin Film Deposition & Photoresist Strip Products
Our chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), and surface preparation systems are used worldwide for the volume production of advanced semiconductor devices at the lowest overall cost to our customers.
Semiconductor device manufacturers use some of our CVD systems to deposit thin films of insulating materials, called dielectrics, using either a plasma-enhanced chemical vapor deposition (PECVD) process or a high-density plasma chemical vapor deposition process (HDP CVD). For certain types of dielectric films used in very high performance devices, a post-deposition treatment (UVTP) may also be required. We also make a CVD system that’s used to deposit conductive tungsten films (W-CVD). We also offer a physical vapor deposition (PVD) system that’s used to deposit aluminum layers on chips that use this conductive metal, as well as copper barrier/seed layers on chips that use copper wiring. Our electrochemical deposition (ECD) product is used to build the copper wires on copper chips. Finally, our surface preparation products are used to clean the wafer in-between manufacturing process steps, removing residues and contaminants.