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NOVELLUS INTRODUCES CONFORMAL FILM DEPOSITION TECHNOLOGY FOR SUB-32NM FRONT-END-OF-LINE AND DOUBLE PATTERNING APPLICATIONS
Aug 16, 2010 |
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San Jose, California -August 16, 2010 - Novellus Systems (NASDAQ: NVLS) announced today that it has developed conformal film deposition (CFD™) technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology addresses sub-32nm requirements for front-end-of-lin...
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NOVELLUS INTRODUCES SABRE® 3D ELECTROPLATING SYSTEM FOR THE ADVANCED WAFER-LEVEL PACKAGING MARKET
Jul 12, 2010 |
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San Jose, California - July 12, 2010 - Novellus Systems (NASDAQ: NVLS) today introduced the SABRE 3D electroplating system for the rapidly-growing advanced wafer-level packaging (WLP) market. Utilizing technology from Novellus' industry-leading SABRE Electrofill® copper damascene interconnect system, SABRE 3D's flexible and modular architect...
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NOVELLUS ANNOUNCES NEW SUITE OF PRODUCTS FOR THE ADVANCED WAFER LEVEL PACKAGING MARKET
Jul 12, 2010 |
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San Jose, California - July 12, 2010 - Novellus Systems (NASDAQ: NVLS) today introduced new models of the company's VECTOR PECVD, INOVA PVD, and GxT photoresist strip systems. The new models leverage Novellus' advanced interconnect technology to address the evolving requirements of the wafer level packaging (WLP) market. In order to meet the tec...
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NOVELLUS SYSTEMS DEVELOPS XMM™ TECHNOLOGY FOR IN-LINE ISOTROPIC COPPER OVERBURDEN REDUCTION
Jun 17, 2010 |
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San Jose, California - June 17, 2010 - Novellus Systems today announced that it has developed patent-pending XMM technology that complements the company's SABRE® Electrofill® copper electrochemical deposition (ECD) process. XMM is an innovative, in-line isotropic wet etch process that significantly reduces post-plated copper overburden...
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NOVELLUS' NEW TUNGSTEN NITRIDE (WN) PROCESS ENABLES ADVANCED COPPER INTERCONNECTS FOR 3XNM MEMORY DEVICES AND BEYOND
May 6, 2010 |
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San Jose, California - May 6, 2010 - Novellus Systems (NASDAQ: NVLS) announced today that it has developed an innovative DirectFill CVD tungsten nitride (WN) liner-barrier film that replaces the conventional physical vapor deposition (PVD) Ti liner and metallo-organic chemical vapor deposition (MOCVD) TiN barrier film stack used for the tungst...
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NOVELLUS ANNOUNCES AVAILABILITY OF THE WEBCAST OF ITS PRESENTATION AT J. P. MORGAN'S 38TH ANNUAL GLOBAL TECHNOLOGY, MEDIA AND TELECOM CONFERENCE
May 4, 2010 |
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SAN JOSE, Calif., May 4, 2010- Novellus Systems, Inc. (Nasdaq: NVLS) today announced that the company will present on Tuesday, May 18, 2010, at J. P. Morgan's 38th Annual Global Technology, Media and Telecom Conference. The presentation will begin at 3:50 p.m. EDT and will be made available over the Internet via a live webcast. Th...
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NOVELLUS DEVELOPS PRECISION ANTI-REFLECTIVE LAYERS THAT ENABLE CRITICAL DIMENSION CONTROL STRATEGIES FOR SUB-32NM LITHOGRAPHY
Apr 22, 2010 |
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San Jose, California -- April 22, 2010 - Novellus Systems (NASDAQ: NVLS) announced today that it has developed precision anti-reflective layer (ARL) patterning films on its VECTOR PECVD platform with less than 2 angstroms wafer-to-wafer thickness variability. The new process technology utilizes VECTOR's multi-station sequential processing (MSSP®...
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PETER WOLTERS' INNOVATIVE SILICON WAFER GRINDING TECHNOLOGY PRODUCES 5X FLATTER WAFERS
Mar 31, 2010 |
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RENDSBURG, Germany - March 31, 2010 - Peter Wolters GmbH, a leading manufacturer of high-precision machine tools and a wholly owned subsidiary of Novellus Systems (NASDAQ: NVLS) today announced that it has developed innovative Planetary Pad Grinding (PPG™) technology based on the well-established AC2000 platform's double-sided proce...
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NOVELLUS SYSTEMS ANNOUNCES JOINT DEVELOPMENT PROGRAM ON COPPER THROUGH-SILICON-VIA (TSV) FOR 3-D SEMICONDUCTOR INTEGRATION
Mar 17, 2010 |
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San Jose, California - March 17, 2010 - Novellus Systems (NASDAQ: NVLS) today announced the establishment of a joint development program (JDP) with the IBM Corporation (NYSE: IBM) to design a manufacturing-worthy, copper-based, three dimensional (3-D) semiconductor Through-Silicon Via (TSV) process using Novellus' SABRE copper electroplating and...
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NOVELLUS DEVELOPS ADVANCED COPPER SEED TECHNOLOGY FOR THROUGH-SILICON-VIA (TSV) PACKAGING
Mar 8, 2010 |
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San Jose, California - March 8, 2010 - Novellus Systems (NASDAQ: NVLS) today announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the emerging through-silicon-via (TSV) packaging market. The process uses Novellus' production-proven INOVA® platform with patented Hollow Ca...
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NOVELLUS SYSTEMS SHIPS 1000TH VECTOR® PECVD SYSTEM
Feb 1, 2010 |
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San Jose, California - February 1, 2010 - Novellus Systems (NASDAQ: NVLS) today announced that it has shipped the company's 1000th VECTOR plasma-enhanced chemical vapor deposition (PECVD) system to GLOBALFOUNDRIES' Fab 7 in Singapore. A leading provider of advanced semiconductor manufacturing technology, GLOBALFOUNDRIES recently integrated the...
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NOVELLUS SYSTEMS LAUNCHES SOLA®XT UVTP SYSTEM FOR SUB-45NM HIGH VOLUME MANUFACTURING
Jan 13, 2010 |
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