The Novellus Family of Products

Novellus manufactures, markets and services advanced semiconductor manufacturing equipment for thin film deposition, surface preparation and CMP. Our chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), ultraviolet thermal processing (UVTP), photoresist and residue removal and CMP systems are used worldwide for the volume production of high-quality semiconductors at the lowest overall cost.

We invite you to learn more about Novellus innovations in CVD, PVD, ECD, UVTP,Surface Preparation and CMP. Manufacturers use our CVD processes for depositing insulating thin films (dielectrics) and conductive thin films (metals). The PVD process uses advanced sputtering techniques to apply an ultra-thin metallic film to the surface of a wafer. The superior properties of the Novellus copper Electrofill™ ECD films are made possible by advanced chemistries and innovations in the wafer fixture and field shaping elements of our ECD system. Our UVTP technology allows our customers to improve the mechanical properties of PECVD films. Our Surface Integrity Group products provide the strip and clean technologies required for manufacturing advanced devices, while the equipment manufactured by our CMP Group planarizes the surface prior to the next deposition.

Start your search here to find more information on our pioneering line of dielectric plasma enhanced CVD (PECVD) products; our dielectric high-density plasma (HDP) CVD products; our industry-leading metal CVD products; our advanced metal PVD products; our copper Electrofill products; our UVTP product; our Surface Preparation products and our CMP products.