Thin Film Deposition & Photoresist Strip Products
We manufacture, market and service advanced semiconductor manufacturing equipment for thin film deposition and surface preparation. Our chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), ultraviolet thermal processing (UVTP), and photoresist and residue removal systems are used worldwide for the volume production of high-quality semiconductors at the lowest overall cost.
We invite you to learn more about our innovations in PECVD, HDP CVD, W-CVD,PVD, ECD, UVTP, and Surface Preparation. Manufacturers use our CVD processes for depositing insulating thin films (dielectrics) and conductive thin films (metals). The PVD process uses advanced sputtering techniques to apply an ultra-thin metallic film to the surface of a wafer. The superior properties of the our copper Electrofill® ECD films are made possible by advanced chemistries and innovations in the wafer fixture and field shaping elements of our ECD system. Our UVTP technology allows our customers to improve the mechanical properties of PECVD films. Finally, our Surface Integrity Group products provide the strip and clean technologies required for manufacturing advanced devices.
Start your search here to find more information on our pioneering line of dielectric plasma enhanced CVD (PECVD) products; our dielectric high-density plasma HDP CVD products; our industry-leading metal CVD products; our advanced metal PVD products; our copper Electrofill products; our UVTP product; and our Surface Preparation products.