|The GxT, G400, and G3D are photoresist strip systems based on the production-proven, market-leading GAMMA platform. Targeted for bulk strip and high-dose implant strip (HDIS) applications, primarily in large DRAM and flash memory fabs, the G400 is the industry's most productive ashing system. Enhanced source technology combined with faster wafer heating provides the G400 with throughputs of over 400 wph for bulk strip applications, and 300 wph for implant strip applications. The GxT, in turn, is designed for critical logic device manufacturing process steps that demand low silicon loss and ultra-low defectivity. The GxT's multi-station sequential processing (MSSP) architecture provides multiple process stations where both temperature and chemistry may be controlled, allowing higher-temperature bulk strip, lower-temperature HDIS and advanced cleaning processes all on the same platform. A version of the GxT, the G3D, is also available for advanced wafer-level packaging applications.