Copper Electrofill Products

Copper interconnects are replacing traditional aluminum interconnects due to copper's superior conductivity and reliability. Semiconductors that are made with copper wiring are up to four times faster, yet much simpler and cheaper to produce. An early proponent of copper, Novellus is helping to lead this revolution with the SABRE® Electrofill™ system.


SABRE NExT™

The SABRE NExT system is designed to meet the challenges of sub-90 nm production requirements, including void-free filling of extremely narrow and deep features, plating on thin seed, and low defects. This tool leverages all the improvements accumulated since the introduction of the first SABRE tool in 1998. At the core of the system is a proprietary single-step chemistry that provides highly reproducible fill at advanced nodes, with reduced defects and an optimal profile for CMP. In addition, a new anode cell design capitalizes on continuing developments in plating chemistry technology, reducing the level of contaminants in the plating bath, while dramatically cutting chemical consumption. For advanced chemistry development, the SABRE NExT can be configured with a secondary bath, enabling production and development efforts on the same tool. SABRE has become synonymous with copper electrofill as it is the most widely- used tool for copper damascene.

SABRE NExT

SABRE Extreme™

Building on the success of the SABRE NExT system, the SABRE Extreme is targeted for the 45 nm and 32 nm technology nodes. SABRE Extreme features a revised plating cell that incorporates the latest membrane technology to improve on-wafer performance and reduce cost-of-consumables. The new system is designed to run the leading edge electrofill chemistry, Viaform Extreme, which is key to providing an advanced filling capability on the narrow, high aspect ratios found at 45 and 32 nm.

SABRE Extreme