Chemical Mechanical Planarization Products

Chemical Mechanical Planarization (CMP) was introduced in the 1980's as a method of extending the capability of optical lithography techniques by increasing the depth-of-focus. Since the technology's introduction, CMP has grown to become a substantial yield enabler, as well as a process step that helps to increase chip speeds and shrink dies. Today, Novellus process development innovations are pushing CMP capabilities to new productivity heights in terms of total wafer metrics control, process transferability, economical extendibility, and greater availability.

XCEDA™

The XCEDA system for 300 mm metal (Copper and Tungsten) CMP applications provides the ultimate combination of technology and productivity that Novellus customers expect. Extendible across multiple sub-65 nm technology nodes without a change in platform, the XCEDA features four polishing modules and three cleaning cells, setting the next benchmark in capital productivity for CMP. The unique orbital motion, through-the-pad slurry delivery and patented pad grooving technology of XCEDA combine to reduce slurry usage by more than 30% while increasing process control and uniformity. The XCEDA's polishing pads, which are 70% smaller than competitive offerings, also contribute to the system's ability to offer the lowest cost-of-consumables in the industry for the CMP application. XCEDA is also compatible with ultra-low-k materials, featuring a low pressure polish for dielectric stacks prone to delamination, and an advanced vapor dryer, based on Rotagoni®  technology patented from IMEC, for watermark-free hydrophobic materials. In addition XCEDA offers CuVision™ in-situ process control system for Cu thickness monitoring, end point detection, and closed-loop-profile control, ensuring consistent polishing performance.

XCEDA