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View: 2009 Press Releases

   Current Topics (2010)

SOLA xT UVTP for sub-45nm high volume manufacturing
Jan 12, 2010
Novellus Systems Ships 1000th Vector PECVD System

Feb 1, 2010

Novellus Develops Advanced Copper Seed Technology For Through-Silicon-Via (TSV) Packaging

Mar 8, 2010

Joint Development Program with IBM for Through-Silicon-Via packaging technology  

Mar 17, 2010

Planetary Pad Grinding Technology for 5X flatter wafers  

Mar 31, 2010

Precision anti-reflective layers for sub-32nm lithography  

Apr 22, 2010

Tungsten Nitride Process for Advanced Copper Memory Devices  

May 6, 2010

XMM Technology for In-Line Isotropic Copper Overburden Reduction  

Jun 17, 2010

Novellus announces new suite of products for advanced wafer level packaging  

Jul 12, 2010

Novellus introduces SABRE 3D for advanced wafer level packaging  

Jul 12, 2010

Conformal film deposition technology for sub-32nm FEOL  

Aug 16, 2010

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